EDIsecure^® ILM Inline Lamination Module

High-speed lamination to extend the durability and security of your cards

Extend the life and security of your cards with the EDIsecure^® ILM Inline Lamination Module. The card surface will be protected against physical damage and the card life will be extended by applying EDIsecure^® clear and secure laminates on the card. Custom or generic holographic foils also help to protect the cards against tampering.

To maximize card security and durability, all EDIsecure^® XID 93xx Retransfer Printers can be combined for inline lamination with the ILM. With the optional external Flipper Unit the ILM can be upgraded to double-side lamination or even to sandwich lamination of different laminates.

• Fastest and most compact card laminator in its class due to portrait mode card lamination
• Single- and double-side lamination possible
• Mechanical lock to secure access to supplies
• Highest positioning accuracy through adjustable laminate position in all 4 directions
• High capacity lamination foils (patch and overlay) reduce operator interaction
• Offers a range of EDIsecure^® clear and secure laminates that extend card life and enhance security
• Custom and generic holographic foils are available to combat fraud and counterfeiting
• “Jumbo Patches” provide for nearly to the edge lamination of durable patch materials

A variety of laminating media is available:
Clear or holographic patches in various thicknesses, patches with chip cut-out for contact smart cards, as well as holographic overlays.